SICK showcases SIG300 and IO-Link Wireless Gateway

12 June, 2025

Combining decades of expertise with the latest IIoT technology

SICK says it is at the forefront of smart sensor innovation, with decades of experience in detection and an extensive portfolio of high-performance digital products that offer wider options for solutions across different industries. The company demonstrated the possibilities of new data integration products such as the SIG300 intelligent IO-Link Master, the new IO-Link Wireless Gateway and the powerful and secure TDC-X plant management tool at Smart Factory Expo 2025. SICK’s digital solutions connect the dots to turn sensor data into actionable insights, positioning the company as a full solution provider.

Star of Booth 5/F90 was the recently launched, powerful and compact SIG300 intelligent IO-Link master. Offering smart connectivity for seamless energy-saving solutions, the state-of-the-art IIoT device forms a bridge between OT and IT. It has a total of eight ports, can process up to 102 digital signals and features EtherNET/IP, PROFINET and EtherCAT fieldbuses, alongside the leading IoT communication protocols (MQTT, OPC UA and REST API).

Enhancing solution integration and data availability as part of the move towards smart factories, the IO-Link Wireless Gateway (WIM) is easy to install and commission without the need for expensive cabling, giving industrial operations greater freedom and flexibility. It features IO-Link and other protocols, delivering access to a wide range of data for predictive maintenance, improved efficiency, real-time monitoring and data-driven decision making.

SICK’s TDC-X next-generation wireless edge solution for telematic data collection is a robust solution suitable for the most demanding end-to-end IoT applications in harsh environments, including factory, logistics and process automation. The IP67-rated device provides powerful edge computing and multi-sensor data acquisition, acting as a wireless gateway with IoT functionality and support for SICK Digital Cloud Services.

The booth also featured SICK’s smart compressed air solution, which detects leaking compressed air connections for a lower carbon footprint. The SICK smart solution features intelligent connectivity for data transparency and eight pre-defined values for easy commissioning. It presents visual information on leaks, excess usage and waste, as well as the anticipated annual cost saving per factory, production hall, line or machine.

SICK experts outline digitisation pillars

SICK’s Strategic Solutions Manager Eugene Lawrence and Strategic Product Manager for Integration Products Johannes Haeringer spoke at the show about how intelligent sensors are enhancing digital solutions. They outlined how SICK’s digital initiatives form three digitization pillars: Ready-to-use solutions, Digital toolbox and C² - Competence and Consulting.